// Open Role at Intel
Accelerate advanced semiconductor process development at Intel Foundry as a Thin Films Module Development Engineer. Focus on metal deposition modules and materials characterization for next-gen technologies.
Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.
Core Responsibilities:
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Minimum Qualifications:
With at least 1+ years of experience in:
Preferred Qualifications:
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College Grad
Shift 1 (United States of America)
US, Oregon, Hillsboro
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field. At least 1+ years of experience in thin film deposition technologies (ALD, CVD, PVD, etc.). Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design.