
// Open Role at Intel
Lead critical Design-Technology Co-Optimization for Intel Foundry's next-gen process technologies, defining and driving analog, mixed-signal, and custom design density and performance. This senior individual contributor role collaborates across diverse teams to resolve technology limits and enable competitive design outcomes.
The Group:
Intel's Advanced Design Foundational IP Organization (AD-FIP) within Design Technology Platform (DTP) drives pathfinding and development of the analog/mixed-signal, RF, and high-speed I/O IP that defines what Intel Foundry's leading-edge process technologies can deliver. The AMS Design-Technology Co-Optimization (DTCO) team sits at the intersection of process technology, design rules, PDK, EDA tools, and circuit design, making sure each new node delivers competitive analog, mixed-signal, and custom-design density, performance, and productivity.
The Role:
We are seeking a senior technical leader in DTCO to define and drive co-optimization of Intel Foundry's next-generation process technologies for analog, mixed-signal, and custom design. You will identify where technology definition limits design outcomes (density, drive, matching, high-voltage support, layout productivity), quantify the impact, and drive resolution across process, design-rule, PDK, EDA, and design teams. This is a senior individual-contributor role with technical leadership across multiple organizations and external EDA partners.
Responsibilities:
Required Skills and Experience:
Preferred Skills and Experience:
Experienced Hire
Shift 1 (United States of America)
US, Oregon, Hillsboro
US, California, Santa Clara
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel (https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003).
Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
- Lead AMS DTCO for future Intel Foundry nodes, evaluating device architecture, design rules, metal stack, and patterning choices. - Run a closed-loop DTCO process: sense issues, prioritize, drive changes, and validate results on silicon and in design. - Quantify technology impact on circuits through layout studies, parasitic-aware benchmarking, and area/performance scaling analysis of AMS building blocks. - Define and drive design-rule and PDK requirements with process, design-rule, OPC, and quality/reliability teams. - Partner with EDA vendors on node enablement for custom and AMS flows, translating tool/flow feedback into technology decisions. - Represent Intel Foundry in technical engagements with EDA partners and foundry customers, presenting DTCO findings and recommendations. - Mentor engineers and set technical direction for the DTCO team. - 5+ years of DTCO experience for analog, mixed-signal, I/O, or custom design on FinFET or more advanced process nodes, at a foundry, IDM technology-development organization, or an EDA vendor. - Experience in at least one of the following: design-rule definition for analog/custom layout, circuit-level technology benchmarking of analog/mixed-signal building blocks, or EDA tool/flow enablement of analog/custom design for a new process node. - Advanced degree (Master's with 15+ years of experience OR Ph.D. with 12+ years of experience) in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related field. - Industry experience in semiconductor technology development, design enablement, or circuit design.